Leidos Defense Systems, is seeking a talented Embedded Design Engineering Intern to join a diverse team to create unique solutions for complex problems. We have offices across the United States that provide responsive, cost-effective engineering, scientific, and IT solutions in the defense, space, cyber, and commercial fields. The ideal candidate will thrive in a learning environment that encourages leadership and technical growth.
At Leidos, our mission is to reach, equip, and teach students with an interest in the field of defense and aerospace. Running for over two decades, the internship program has been a staple at Leidos, giving interns hands-on experience in their future career path. With no shortage of work available, interning with Leidos promises growth, experience, and unrivaled opportunity across the US.
This position is an Embedded Design Engineering Intern in the Electrical Systems Department. The selected candidate will have an opportunity to experience and learn about all phases of the product life cycle from concept development and detailed design through manufacturing, integration, testing, and post-delivery support. Additional learning opportunities related to digital-signal processing (DSP) design, printed circuit board (PCB) design, experience with technical trade studies, and evaluation of technology improvements will be provided to the engineering student through this internship.
Primary Responsibilities
Designing embedded software and firmware
Performing HDL simulations and software unit tests
Hands-on laboratory testing with instrumentation, test equipment, and debug/test methods
Performing in a collaborative engineering environment working closely with multi-disciplinary teams
Working with platforms such as FPGAs, microcontrollers, microprocessors, and mixed signal designs.
Basic Qualifications
Currently enrolled in an accredited college / university and currently working towards a degree in Computer Engineering or a related field.
Experience with C, C++, or Rust embedded software programming through course work, lab projects, and previous internships.
Demonstrates problem solving, teamwork, and communication skills.
Holds a GPA of 3.0 or higher.
Includes resume and unofficial transcripts in application.
Must be a US Citizen and be able to obtain and maintain a DoD Secret security clearance.
Preferred Qualifications
Preference shown to candidates who have experience and/or working knowledge of:
Utilizing modern Xilinx FPGA and SoC families and design tools (RFSoC, Xilinx IP Cores, AXI4, AXI-Stream)
Basic knowledge of FPGA/Firmware languages (VHDL, Verilog, SystemVerilog, assembly, Rust)
Experience with simulation and test frameworks
RISC microprocessors architectures (ARM Cortex, Microblaze, PowerPC, RISC-V)
Memory architectures, types, and caching
GNU/Linux and developing kernel drivers
Communication protocols such as: UART, Ethernet, SPI, I2C, CAN bus, etc.
Embedded operating systems (Linux, VxWorks, Integrity, FreeRTOS, Zephyr, uC/OS-II)
Electronics and PCBA design
Leading design teams including technical leadership, budgeting, and scheduling
